Description
Product Details
SILCOTHERM 2 Part Addition cure silicone encapsulant
Thermally conductive
Low modulus
1:1 Mix Ratio
Low modulus
1:1 Mix Ratio
Specifications
| Trade Name | QSil 553 |
|---|---|
| Product Material | Silicone |
| Package Type | Kit |
| Package Size | 2 L |
| Special Properties | Thermal Conductivity |
| Cure Time | 24 h @ 25 °C, 7 min @ 100°C |
| Thermal Conductivity | 0.68W/mK |
| Maximum Operating Temperature | +260°C |
| Minimum Operating Temperature | -55°C |
| Physical Form | Viscous Liquid |
| Operating Temperature Range | -55 → +260 °C |
| Volume Resistivity | 4.02E+14Ω cm |
| Viscosity Measurement | 6000mPa/s |
ava.sweet –
Pleasant to use at home. Been using it for 2 weeks and already see results! Very fast delivery, thank you.
jules_fr –
Exactly as in the pictures.
James P. –
Product as expected.
andrea_roma –
Everything works perfectly so far.
giuseppe_it –
No complaints. Very good experience. Very satisfactory. Everything as expected.